The only other thing I would consider is when scoring the High Speed laminates the polyimide gets relatively thick and scoring can be a pain to break apart. Seems like any 2mil maybe 3mils or less works pretty good with the scoring method and using the cutting wheel at assembly to break apart. This should also be evaluated when using the old fashion web/micro drill the thicker polyimide can be a pain to break apart.
Thank you, Jim Mahoney
Mass Design Inc.
Applications Engineer
P# 603-886-6460 X215
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lehmicke, Michael
Sent: Friday, March 16, 2012 9:08 AM
To: [log in to unmask]
Subject: Re: [TN] Panelization of Rigid-Flex assemblies
Amol,
When we panelize rigid Flex, depending on the shape, we use either a partial route and "cracker cut' or we add rails that are scored, which can then be snapped off after assembly.
Mike Lehmicke
Molex Copper Flex products
22 Empire Drive
St. Paul, MN 55103
651-846-7728
[log in to unmask]
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Amol Kane (Asteelflash,US)
Sent: Thursday, March 15, 2012 8:16 AM
To: [log in to unmask]
Subject: [TN] Panelization of Rigid-Flex assemblies
Dear Technetters,
We will be building some rigid flex boards on SMT that are about 2x2".
They will need to be panelized to run. We had previously run such
assemblies in a multiple up SMT pallets, but I am curious to know if
there are methods/best practices for panelizing the flex part of the
circuit from a depanelizing perspective. i.e can they be panelized and
then separated and if yes, how?
Thanks,
Amol
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