Donald,
From the looks of things, that's exactly what we're going to have to do...
Leland
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Donald Kyle
Sent: Wednesday, March 28, 2012 3:52 PM
To: [log in to unmask]
Subject: Re: [TN] Rework Concern and Question
Leland
The next time you need to remove this I.C., why don't you clip each lead off first, remove the body and then unsolder each lead one at a time.
I would be surprised if your people still had an issue with removing each lead.
Cheers
Donald
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of vladimir Igoshev
Sent: Tuesday, March 27, 2012 2:12 PM
To: [log in to unmask]
Subject: Re: [TN] Rework Concern and Question
Sorry Ben, it doesn't.
Leland,
What you are saying sounds strange. What does it mean: "We've analyzed the lead material beneath the SEM and it returns 98% tin and 2% silicone"? Did you analyzed leads or solder? Where the analysis was taken from? Did you analyzed leads with pads ripped off?
Regards,
Vladimir
SENTEC Testing Laboratory Inc.
11 Canadian Road, Unit 7.
Scarborough, ON M1R 5G1
Tel: (416) 899-1882
Fax: (905) 882-8812
www.sentec.ca
-----Original Message-----
From: "Gumpert, Ben" <[log in to unmask]>
Sender: TechNet <[log in to unmask]>
Date: Tue, 27 Mar 2012 18:58:21
To: <[log in to unmask]>
Reply-To: TechNet E-Mail Forum <[log in to unmask]>,
"Gumpert, Ben"
<[log in to unmask]>
Subject: Re: [TN] Rework Concern and Question
Leland,
I won't claim to be an expert, but this website seems to imply something along those lines.
http://resource.npl.co.uk/mtdata/phdiagrams/sisn.htm
Ben
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Leland Woodall
Sent: Tuesday, March 27, 2012 2:18 PM
To: [log in to unmask]
Subject: EXTERNAL: [TN] Rework Concern and Question
Folks,
We've ran across a strange incident and I'd like a little advice from the group.
We recently underwent a component vendor change, and part of the first group of boards were misbuilt due to incorrect polarity (the part marking was misinterpreted by the vision operator).
Anyway, an attempt to remove the part by our Repair group resulted in lifted pads on 10 of the first 12 boards. We've analyzed the lead material beneath the SEM and it returns 98% tin and 2% silicone. The old style component comes off quite easily (within 3 seconds), and an analysis of its leads shows to be 100% tin. It's a 6 pin diode with very little mass.
What's going on here? Does a 2% silicone mix raise the melting point of solder by 200 degrees C?
Please help me understand.
Thanks,
Leland
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