I'm looking for input on the following plating defect.
 
I observe a plating void that occurs on a Cu plated feature with ENIG finish.    The void goes down to the base material.  The defect is typically .002 diameter.  The feature size is .010 across.  The parts run on a manual plating line and hang on a small plating rack.   
 
The plating engineer believes the root cause of the void is a bubble on the part during plating.  The action plan includes implementing stronger vibration on the part in the plating bath.  
 
I have two questions.  
1.  How much vibration is typically needed to avoid developing a bubble on a part during plating?
2.  For this plating void defect, is it possible that Ni corrosion or other reliability concerns would eventually develop if defective parts escaped?   
 
Thank you,
 
Mark Julstrom

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