Key point is gas tight. Ag/AgO/AgO2 all conductive, perfect for contact with absence of S, Cl, etc. Ag-Pd also being used in the past. If you use higher current, connector is easy to get good performance (not the extremely high current). If it is low voltage, low current, stay with gold.
Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Thursday, February 16, 2012 1:37 PM
To: [log in to unmask]
Subject: Re: [TN] Silver immersion with gold fingers
Not an answer on your question.
( Actually, I wonder if not one could use silver all over. Many years back
a lot of manufacturers had silver fingers. Together with correctly designed
connector forks, the contact points were gas tight, and there was no
problem with connection reliability. If the boards will be slided in/out
several times, you need of course thicker silver than the std ImAg.
Wouldn't that be worth a study now when gold is extremly expensive.?)
My two sixpence
Inge
On 10 February 2012 16:48, John Burke <[log in to unmask]>wrote:
> Having some issues with silver immersion on a board with gold pated
> fingers - anyone having success with this?
>
> Issue apparently is in masking off the gold during the silver process.
>
> John
>
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