Technetters, is there any value in baking a PCB panel after its external layers have been plated, the plating resist stripped, and it has gone through the aqueous cleaning process after the strip operation, given that the next step is an aqueous preparation for solder resist adhesion promotion? The bake is at 250 F for 30 minutes. Thanks for any comments. I am wondering if this baking is something required from the old days, and if, despite changes in other processes before or after, no one ever thought of taking it out of the production flow.

Louis Hart
Compunetics
Monroeville, PA
USA
[log in to unmask]<mailto:[log in to unmask]>
412-858-1232


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