Dear Technetters,

We have soldermask flaking off from the traces on a PWB after the wave
process (LF NC process). The same date code in stock passes the tape
test per IPC-TM-650 Test Method 2.4.28.1. For non melting materials (Cu
traces), is there another test I can do after assembly to test adhesion
of the mask? If the board fails the tape test after assembly, is that a
valid use of the test method to reject the bare board? The boards in
stock are over a year old (in dry pack condition), but moisture or age
should not affect the function of correctly processed soldermask, should
it?

 

My take is that Soldermask applied to a clean Cu substrate and fully
cured should not flake off even after assembly, but I am searching for a
standard or a clause I can use.

 

Thanks,

Amol

 

 

 

 


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