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February 2012

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Subject:
From:
Steve Gregory <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steve Gregory <[log in to unmask]>
Date:
Wed, 29 Feb 2012 14:41:42 -0500
Content-Type:
text/plain
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text/plain (47 lines)
Hey Victor!

Got your pictures, and they don't look too good:

http://stevezeva.homestead.com/DIMM_Contcat_corrosion-1.JPG

http://stevezeva.homestead.com/DIMM_Contact_with_corrosion-1a.JPG

I know that probably someone else that has seen this before will be able to
be more specific this appearance that I can...

Steve


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, February 29, 2012 9:53 AM
To: [log in to unmask]
Subject: [TN] Field Return Product w/corrosion product

Fellow TechNetters;

   Do No Clean LF fluxes, Rosin Core/molten solder, have a corrosive ion?
Every so often when conducting analysis on Field Return Product I notice
small amount of corrosion product on gold plated contact on DIMM and PCI
Slot connector.   Sometimes on other gold plated connector leads.   So I am
trying to understand which component had a corrosive ion waiting for the
right conditions to flourish.   Small amount of greenish/bluish residue.
It can be seen on wipe zone and/or stamp edge of contact.   Where is this
active corrosive ion coming from?

   Can someone provide the link to Stevezea home page for posting pictures?

Victor,


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