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February 2012

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Subject:
From:
Steven Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Creswick <[log in to unmask]>
Date:
Wed, 29 Feb 2012 12:06:20 -0500
Content-Type:
text/plain
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text/plain (62 lines)
Victor, I believe Steve's address is - [log in to unmask]

Steve Creswick

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Phil Bavaro
Sent: Wednesday, February 29, 2012 11:19 AM
To: [log in to unmask]
Subject: Re: [TN] Field Return Product w/corrosion product

Just send it directly to him.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Wednesday, February 29, 2012 6:53 AM
To: [log in to unmask]
Subject: [TN] Field Return Product w/corrosion product

Fellow TechNetters;

   Do No Clean LF fluxes, Rosin Core/molten solder, have a corrosive
ion?   Every so often when conducting analysis on Field Return Product I
notice small amount of corrosion product on gold plated contact on DIMM
and PCI Slot connector.   Sometimes on other gold plated connector
leads.   So I am trying to understand which component had a corrosive
ion waiting for the right conditions to flourish.   Small amount of
greenish/bluish residue.   It can be seen on wipe zone and/or stamp edge
of contact.   Where is this active corrosive ion coming from?

   Can someone provide the link to Stevezea home page for posting pictures?

Victor,


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