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February 2012

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Subject:
From:
"Gumpert, Ben" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Gumpert, Ben
Date:
Thu, 23 Feb 2012 21:22:37 +0000
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Exactly! More complications for the problem.

Ben

From: Larry Dzaugis [mailto:[log in to unmask]]
Sent: Wednesday, February 22, 2012 4:31 PM
To: TechNet E-Mail Forum; Gumpert, Ben
Subject: EXTERNAL: Re: [TN] Is this a gull wing lead?

Additional problem:
how many leads ?
from co-planarity table:
Min stencil thickness doubles just to reach bottom of lead from .004 for 5-10 leads to .008 mil for 25-36 leads.

This is before you have enough paste to create the large fillet.
On Wed, Feb 22, 2012 at 1:42 PM, Gumpert, Ben <[log in to unmask]<mailto:[log in to unmask]>> wrote:
Technetters,

Is anyone using the TSM series connector from Samtec?
See: http://www.samtec.com/documents/webfiles/cpdf/TSM-1XX-XX-XX-DV-S-XXX-XX-MKT1.pdf

Is this considered a gull wing for J-STD-001 solder joint requirements?

At .63 mm square, this is a relatively thick lead that requires a lot of solder to get a heel fillet to the top of the lead (class 3 solder joint). I realize that there are several ways to add solder (overprint, dispense, preforms, etc.), but I don't want to go down those paths if I'm not working to the right requirement.

Ben


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