TECHNET Archives

February 2012

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Joyce Koo <[log in to unmask]>
Date:
Fri, 17 Feb 2012 18:14:40 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (40 lines)
I thought BGA are for electrical contact, not hardness tester.  Why? Uni-directional excessive pressure?  20g per BGA heat sink?  Copper Bucket of water for cooling? 

Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Lefebvre
Sent: Friday, February 17, 2012 1:09 PM
To: [log in to unmask]
Subject: [TN] Max downward pressure applied to BGA with heat sink

Hello,  I wanted to know if anyone has a information regarding this question.  What is the maximum downward pressure that can be applied to a BGA for a heat sink application.  Is there a general guideline.  I read some stuff on Altera's website they specify the following here is the link http://www.altera.com/support/kdb/solutions/rd04172001_4367.html.

I understand there are several variables to consider, board size, thickness, PCB surface finish, solder type and how it is supported on the underside of the BGA.

Given the board is 10.00" x 8.00", .063" thick.
The BGA is Lead Free 35mm 1600pin component.
Pressure applied from the top.  Bottom side pressure applied with a 2" offset from the Top Side BGA.  Solder is SAC305.

Thanks in advance for you help I hope this is enough information to work with.

Scott


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

---------------------------------------------------------------------
This transmission (including any attachments) may contain confidential information, privileged material (including material protected by the solicitor-client or other applicable privileges), or constitute non-public information. Any use of this information by anyone other than the intended recipient is prohibited. If you have received this transmission in error, please immediately reply to the sender and delete this information from your system. Use, dissemination, distribution, or reproduction of this transmission by unintended recipients is not authorized and may be unlawful.

______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask] 
______________________________________________________________________

ATOM RSS1 RSS2