Hello,  I wanted to know if anyone has a information regarding this question.  What is the maximum downward pressure that can be applied to a BGA for a heat sink application.  Is there a general guideline.  I read some stuff on Altera's website they specify the following here is the link http://www.altera.com/support/kdb/solutions/rd04172001_4367.html.

I understand there are several variables to consider, board size, thickness, PCB surface finish, solder type and how it is supported on the underside of the BGA.

Given the board is 10.00" x 8.00", .063" thick.
The BGA is Lead Free 35mm 1600pin component.
Pressure applied from the top.  Bottom side pressure applied with a 2" offset from the Top Side BGA.  Solder is SAC305.

Thanks in advance for you help I hope this is enough information to work with.

Scott


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