hi wendi, i dont see a reason for rejection here. technically, the plating 
layers may be 'separated' as plated, because of residual holefill; but to 
me the spec intends to reject separation between plating layers, metal to 
metal.....

Joey Rios
PWB & Process Quality Eng'r
Endicott Interconnect Technologies
1093 Clark St.
Endicott, NY 13760
Office: 607-755-5896



From:   Wendi Boger <[log in to unmask]>
To:     <[log in to unmask]>, 
Date:   02/23/2012 02:37 PM
Subject:        [IPC-600-6012] Via Fill on Surface Plate
Sent by:        IPC-600-6012 <[log in to unmask]>



Everyone,

   Can I get your option on the attached pictures.  They show via fill 
material that has not been sanded as to flush with the surface.  There is 
no evidence of separation between copper to fill or copper to copper.  The 
question is what is the intent of the spec and what criteria should be 
used to assess.

Thanks,
Wendi Boger

[cid:[log in to unmask]][cid:[log in to unmask]][
cid:[log in to unmask]][cid:[log in to unmask]]



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[attachment "image011.png" deleted by Jose A Rios/Endicott/EIT] 
[attachment "image012.png" deleted by Jose A Rios/Endicott/EIT] 
[attachment "VIA FILL OVER KNEE.XLSX" deleted by Jose A Rios/Endicott/EIT] 



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