My opinion in as few words as possible: a normal SM is nearly ' impossible
' to remove mechanically. You need 'strong' chemicals.

( I've never used the tape test. I used my  own method: scrape with a fresh
scalpel blade. Don't do it yourself. Non conformance method)
Basta

Inge

On 7 February 2012 15:59, Amol Kane (Asteelflash,US) <
[log in to unmask]> wrote:

> Dear Technetters,
>
> We have soldermask flaking off from the traces on a PWB after the wave
> process (LF NC process). The same date code in stock passes the tape
> test per IPC-TM-650 Test Method 2.4.28.1. For non melting materials (Cu
> traces), is there another test I can do after assembly to test adhesion
> of the mask? If the board fails the tape test after assembly, is that a
> valid use of the test method to reject the bare board? The boards in
> stock are over a year old (in dry pack condition), but moisture or age
> should not affect the function of correctly processed soldermask, should
> it?
>
>
>
> My take is that Soldermask applied to a clean Cu substrate and fully
> cured should not flake off even after assembly, but I am searching for a
> standard or a clause I can use.
>
>
>
> Thanks,
>
> Amol
>
>
>
>
>
>
>
>
>
>
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