Wendi - I don't believe this is rejectable at all  - along as there is
Cu to Cu contact on both ends and no Cu to Cu separation after TS. A 10
mil hole that is hole filled with 2 mils of material of either side is
no different than a 14 mil hole that is filled - as long as the Cu to Cu
plate is intact. 

Jim

-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Wendi
Boger
Sent: Thursday, February 23, 2012 2:37 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Via Fill on Surface Plate

Everyone,

   Can I get your option on the attached pictures.  They show via fill
material that has not been sanded as to flush with the surface.  There
is no evidence of separation between copper to fill or copper to copper.
The question is what is the intent of the spec and what criteria should
be used to assess.

Thanks,
Wendi Boger

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