I like Don's ball shear test suggestion. However thermal cycling is also important. Perhaps perform a 10x solder reflow test per IPC-TM-650 Method 2.6.27 at either SnPb or Pb-free reflow profiles, whichever matches the application, before ball shear test.
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Dupriest, Don
Sent: Thursday, February 23, 2012 6:42 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
I agree, we may need to make reference to the long ago misregistration requirement for surface only in this case. I think if the features are only associated with a ground pad or plane it may not be as critical and can just be a dimension beyond the "as drilled" diameter. Ball attachment sites would carry the most risk and need both minimum annular ring and registration. We have an internal specification that addresses "residual via fill material" for internal subs. Its condition is where fill has been left in a low dimple area though. It's different from this.
Only time before it comes up again I'm sure, pretty important one to work on.
Wendi, from an MRB situation I would suggest send some parts out for ball shear if applicable to the component technology. Have balls added to attachment sites. Test them to JESD22-B117A (typical shear speed 1mm/s at a 100 micron height above the board). If failures are around 1600 grams and the failure mode is Pad Crater; I would think you could say it has little impact on performance. Just a suggestion. Others may have alternate MRB suggestions.
C. D. (Don) Dupriest
Lockheed Martin - MFC
Advanced Manufacturing Technology
member of:
Production Technical Excellence Staff
Ph. 972/603-7724 fax: 972/603-9052
Email: [log in to unmask]
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Reed, Randy
Sent: Thursday, February 23, 2012 4:59 PM
To: [log in to unmask]
Subject: EXTERNAL: Re: [IPC-600-6012] Via Fill on Surface Plate
Russ,
What does the pad look like on the other side of the hole. When we make limits and rules for this condition, the condition on both sides of the PTH is important.
Randy
Randy Reed, CQE
Reliability Lab
Viasystems Group Inc.
[log in to unmask]
503.992.4421-direct l 503.545.0150-cell
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Russ Shepherd
Sent: Thursday, February 23, 2012 1:05 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
I agree there should be some limits to this condition.
Would this example also be considered acceptable?
[cid:[log in to unmask]]
Best Regards.
Russ Shepherd
Laboratory Director
Microtek Laboratories
1435 Allec Street
Anaheim, CA 92805
(714) 999-1616
www.thetestlab.com
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Chris Mahanna
Sent: Thursday, February 23, 2012 11:56 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
Agreed. Assuming that annular ring is required, there has to be an ever so small connection, that isn't broken by thermal stress.
I don't think tape test wouldn't be a conformance requirement, unless you had vias in the pads that you defined for your plating adhesion protocol.
Chris
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Denise Chevalier
Sent: 2012/02/23 2:49 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
Wendi - I would not reject but would make sure the cap plate stays intact during thermal stress and tape test
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Wendi Boger
Sent: Thursday, February 23, 2012 2:37 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Via Fill on Surface Plate
Everyone,
Can I get your option on the attached pictures. They show via fill material that has not been sanded as to flush with the surface. There is no evidence of separation between copper to fill or copper to copper.
The question is what is the intent of the spec and what criteria should be used to assess.
Thanks,
Wendi Boger
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