Wendi,
I think there needs to be some limits on this condition. I'm worried about long term reliability. Organic material between the 2 copper layers will expand and may start a crack propagating between the 2 layers. For most vias this may not be a problem since the pad may be very large or connected to a trace that is not likely to fail. However, BGA pads are not large and if the surface disconnects from the via then we will have a problem.
Bill
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Nick Koop
Sent: Thursday, February 23, 2012 3:30 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
Wendi,
I would agree as well. Seems like an area where we should set some limits. I'd bet this is not the first time this has happened, and won't be the last. For example, should we require a minimum of .0005" ( 12 um) connection of cap plating to through hole plating on both sides of the hole?? Just throwing out numbers to start the conversation...
Nick
>>> Chris Mahanna <[log in to unmask]> 2/23/2012 1:56 PM >>>
Agreed. Assuming that annular ring is required, there has to be an ever so small connection, that isn't broken by thermal stress.
I don't think tape test wouldn't be a conformance requirement, unless you had vias in the pads that you defined for your plating adhesion protocol.
Chris
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Denise Chevalier
Sent: 2012/02/23 2:49 PM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
Wendi - I would not reject but would make sure the cap plate stays intact during thermal stress and tape test
-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Wendi Boger
Sent: Thursday, February 23, 2012 2:37 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Via Fill on Surface Plate
Everyone,
Can I get your option on the attached pictures. They show via fill material that has not been sanded as to flush with the surface. There is no evidence of separation between copper to fill or copper to copper.
The question is what is the intent of the spec and what criteria should be used to assess.
Thanks,
Wendi Boger
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