It does matter if there is contact if it is a BGA via-in-pad. I think it should have a "contact" requirement of 25 µm, similar to that shown Fig 3-16 from IPC-6012, attached. But no, I don't know of a specific existing requirement.
Matt Byrne
607-953-9820
BAE Systems Controls Inc.
Huron Campus, Building 257
1701 North Street, Endicott, NY 13760
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Paul Reid
Sent: Friday, February 24, 2012 9:11 AM
To: [log in to unmask]
Subject: Re: [IPC-600-6012] Via Fill on Surface Plate
Well here is my opinion;
It does not matter if the cap stays on the barrel of the PTH or not
because it is not part of the conductive path. The conductive path is
down the copper foil and electroplated part of the PTH. The cap if
lifted would not cause and open. Until you stick a solder ball or bury
it and put a microvia on a cap it is not part of the circuit. It is not
required to have conductivity.
If you do not worry about trapped contaminants then, from a practical
point of view, this should be acceptable.
Sincerely,
Paul Reid
Program Coordinator
PWB Interconnect Solutions Inc.
235 Stafford Rd., West, Unit 103
Nepean, Ontario Canada, K2H 9C1
613 596 4244 ext. 229
Skype paul_reid_pwb
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-----Original Message-----
From: IPC-600-6012 [mailto:[log in to unmask]] On Behalf Of Wendi
Boger
Sent: February 23, 2012 2:37 PM
To: [log in to unmask]
Subject: [IPC-600-6012] Via Fill on Surface Plate
Everyone,
Can I get your option on the attached pictures. They show via fill
material that has not been sanded as to flush with the surface. There
is no evidence of separation between copper to fill or copper to copper.
The question is what is the intent of the spec and what criteria should
be used to assess.
Thanks,
Wendi Boger
[cid:[log in to unmask]][cid:[log in to unmask]]
[cid:[log in to unmask]][cid:[log in to unmask]]
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