左边应该是人工修整后的残留,右边才是WS制程的状况,正常WS制程的残留无需清洗,除非客户有特效要求。
Best Regards
Xunisa, Yun
EXT:021-24031000-63184,MVPN:663184
MPT/IPT – Inventec Group
-----邮件原件-----
发件人: TGAsia [mailto:[log in to unmask]] 代表 Roger Liu
发送时间: 2012年2月15日 9:49
收件人: [log in to unmask]
主题: Re: [TGAsia] Non-clean Flux Residue
陈工,
该产品不是从返修来的,属于正常的工艺产生。
插头的助焊剂会导致锡的电迁移,边缘的助焊剂接触另一个PCB的焊盘,也会导致锡的
电迁移。
图纸上没有要求,但是从功能上来讲我们要求助焊剂的残留不能导致电迁移一类的可
靠性问题。
但是没有一个明确的定义来要求
Best Regards!
Roger LIU / 刘芝新
From: "czd" <[log in to unmask]>
To: <[log in to unmask]>, <[log in to unmask]>
Date: 02/15/2012 09:23 AM
Subject: Re: [TGAsia] Non-clean Flux Residue
刘工:您好!
这是返修的人工操作,从操作层面来讲免清洗助焊剂残留痕迹肯定会有,这个没有
绝对的标准,主要考虑:1、对您的产品性能有没有影响;2、公司标准有没有要
求;3、顾客有没有这方面的要求。从自身实际考虑为托。
陈
----- Original Message -----
From: Roger Liu
To: [log in to unmask]
Sent: Wednesday, February 15, 2012 9:00 AM
Subject: [TGAsia] Non-clean Flux Residue
(See attached file: Flux Residue2.pptx)
请教各位专家:
如图示,免清洗助焊剂残留是否可以接受?
如果不可以接受,请教应该引用什么标准来要求?
Best Regards!
Roger LIU / 刘芝新
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