The IPC-610E, section 5.2.11 describes lead-free fillet lift as a "phenomenon in which the solder fillet is lifted off from the land on a board mainly during the flow solder process."

It sounds a little supernatural to me using the term "phenomenon."  I was just curious what exactly the cause(s) of fillet-lift were and why wouldn't it be considered a defect - similar to non-wetting?

Best Regards,
Jeff



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