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February 2012

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TechNet <[log in to unmask]>
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Date:
Fri, 17 Feb 2012 10:11:33 -0600
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TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
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Subject:
Re: Solder etchant, Sn-99.3-Cu-0.7, Post Thermal Cycle induced fractures
From:
Victor Hernandez <[log in to unmask]>
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Fellow TechNetters:

   Can someone provide a recommended etchant for the above stated alloy.   Want to determine micro structure.

Victor,


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