On 12 January 2012 08:38, Inge Hernefjord <[log in to unmask]> wrote:



> We have been using LDS for many years making electronic modules and
> antennas. Most do so nowadays, I think. I don't have a specialist's knowhow
> here, but I've been inspecting our antennas several times and I found that
> there was one little problem. If the 3D structure is having narrow and deep
> areas, cleaning seemed to be a problem. Look at your hand with stretched
> fingers. There may be some residues left between the fingers, closest to
> the palm. So, the advice is of course to avoid 'pockets'. Plating itself
> seemed to be fairly easy. I wrote an inspection instruction for the group,
> but I  have no right to use it outside the company .
> Not much of contribution, hope there will be more.
>
> Inge
>
>  On 12 January 2012 06:54, [log in to unmask] <
> [log in to unmask]> wrote:
>
>> I'm looking for guidance on qualifying a vendor plating process using
>> Laser Direct Structuring (LDS) plastic parts.  Also, what ongoing QC steps
>> should be included to assure reliability of the conductor path layers.  The
>> traces have copper, nickel and gold plating.  The program will ramp to high
>> volume.  I want to get in front of any potential risks.   I've done some
>> research on LDS plating technology but also seek any lessons learned that
>> you might already have.
>>
>> Regards,
>>
>> Mark Julstrom
>>
>> ______________________________________________________________________
>> This email has been scanned by the Symantec Email Security.cloud service.
>> For more information please contact helpdesk at x2960 or [log in to unmask]
>> ______________________________________________________________________
>>
>> ---------------------------------------------------
>> Technet Mail List provided as a service by IPC using LISTSERV 16.0
>> To unsubscribe, send a message to [log in to unmask] with following text in
>> the BODY (NOT the subject field): SIGNOFF Technet
>> To temporarily halt or (re-start) delivery of Technet send e-mail to
>> [log in to unmask]: SET Technet NOMAIL or (MAIL)
>> To receive ONE mailing per day of all the posts: send e-mail to
>> [log in to unmask]: SET Technet Digest
>> Search the archives of previous posts at:
>> http://listserv.ipc.org/archives
>> For additional information, or contact Keach Sasamori at [log in to unmask] 847-615-7100
>> ext.2815
>> -----------------------------------------------------
>>
>
>


______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________

---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------