I'm looking for guidance on qualifying a vendor plating process using Laser Direct Structuring (LDS) plastic parts. Also, what ongoing QC steps should be included to assure reliability of the conductor path layers. The traces have copper, nickel and gold plating. The program will ramp to high volume. I want to get in front of any potential risks. I've done some research on LDS plating technology but also seek any lessons learned that you might already have.
Regards,
Mark Julstrom
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