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Date: | Sat, 7 Jan 2012 08:58:59 +0200 |
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You don't state the nature and type of component failures: corrosion,
dendrites etc. However, the spec sheet is right: BIG mistake not to
clean this type of flux correctly. You must wash the boards thoroughly
all over and follow by an adequate number of good rinses. If your tap
water is not too hard, you may get away with just the last rinse or two
as DI.
You should also state whether the boards are required for hi-reliability
(space, avionics, military etc.) apps. If so, you need some form of
process control, such as ionic contamination testing, after qualifying
the process with ion chromatography and SIR/ECM testing.
Brian
On 07/01/2012 06:57, Gary Bremer wrote:
> Where I am working presently they are having component failures that are soldered with water soluble flux and solder. I observed their cleaning process and they are using room temperature distilled water and spot cleaning the solder joint only. Any opinion on this cleaning process pro/con? The flux that is being used 2331-ZX which has 2.2% halides. The tech data sheet for this states that DI-water of distilled water heated to 130° to 150° Fahrenheit and flush the area.
>
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