Hi Joyce,
I believe you are looking for the paper Dave Hillman talked about not so long ago, The last will of BGA voids, available in the SMTA 2011 proceedings.
Good luck,
Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
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N'imprimer que si nécessaire - Print only if you must
I am getting old. There is an good reference voids formation at BGA/CSP,
regarding the SMT reflow condition vs voids location within the solder
joints (near UBM, middle of the solder ball, or close to the bottom of the
copper pad, excessive flux, etc.) with all nice schematics, including via in
pad and dogbone design. My brain is a Tofu now. Any of the smart guys and
gals can lead me to the right paper? Or any of the group members are the
author or co-authors of the paper? Really appreciated (didn't even recall
author's name or affiliation... totally brain dead). Many thanks in
advance.
Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
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