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January 2012

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Subject:
From:
Mike Fenner <[log in to unmask]>
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Date:
Wed, 25 Jan 2012 17:29:29 +0000
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HI
Along time ago when I was involved with Ablefilm, you could option the glass
mesh thickness, [relative thickness to overall thickness], and on some
products the weave. This would - if you still can - give you the ability to
restrict the ooze also.




Regards

Mike Fenner
Bonding Services & Products
T: +44 [0] 1865 522 663 E: [log in to unmask]




-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge Hernefjord
Sent: Tuesday, January 24, 2012 10:40 PM
To: [log in to unmask]
Subject: Re: [TN] Heatsink Bonding

William,
it seems to me as a question of viscosity. Ask for a film with somewhat
higher value or lower the processing  temperature. The later will result in
longer processing time, which you may not accept if it's a high volume
line. We have been bonding boards on aluminum heatsinks for years with
Staystik 811 without flowing issues. Just as an example.

Inge



On 24 January 2012 16:18, William Noel <[log in to unmask]> wrote:

> Hello all - We have a project for which every PCB assembly needs to be
> bonded to a heatsink for thermal transfer from the devices on the board to
> the heatsink and out through the Heatsink mounting hardware to the box
that
> houses the assembled board/heatsink "modules".  One of the requirements we
> have is that when the board assembly is mounted to the heatsink it needs
to
> be electrically isolated from the ground potential associated with the
> heatsink and box mounting hardware.  As a result, we have used a
> combination of ablefilm and glass microspheres at the bonding interface
> between the board assembly and heatsink.  The ablefilm serves as the bond
> and the glass microspheres provide electrical isolation.  The problem we
> have consistently had with this process is squeeze out of the ablefilm
> through the holes in the vias of the board.  We have attempted to use
> soldermask to tent the vias and thereby essentially seal the top surface
of
> the board.  This has worked somewhat but we still seem to have problems
> with this approach.  Does anyone else out there have experience with this
> and could share some advice with us.  Thanks in advance for any help you
> can share.
>
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