Hi Jason
You want to first look in IPC-6012, particularly in sections Table 3-2, location specs in section 3.4.1, breakout data in 3.4.2, specs for blind/buried vias in Fig. 3-13, wrap and fill data in 3-14, and fill spec in 3.6.2.16 and more particularly in IPC 4761 which defines specifications for protection measures. Also, IPC 2221 defines via hole tolerance, and many other via plating specs.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Jason Roetz
Sent: Wednesday, January 25, 2012 9:02 AM
To: [log in to unmask]
Subject: [TN] Via In Pad

Can anyone point me to an IPC specification that I can reference in
regards to via in pad acceptability?

 

Alternatively, if this does not exist, what would be acceptable criteria
for flatness, voids & dimples for VIP (filled and cap plated)?

 

TIA,

 

Jason Roetz
Master Designer
Electrical Group, Industrial Controls Division
4201 North 27th Street 
Milwaukee, WI. 53216 
Telephone: 414-449-6397 
Fax: 414-449-7319

[log in to unmask] <mailto:[log in to unmask]> 
http://www.eaton.com/ <http://www.eaton.com/>  

 

 

 


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