Carl,
What would be the benefit with 100% filling such large 'holes' , if it ain't
for thermal transfer purpose?
100% filled vias do not make it a much better electrical path (90% of the
current flows in the copper barrel).
I don't know exactly what you mean by 'holes'. Perhaps you should tell us.
I don't have IPC-610 on my desk for the moment, but a look there ought to
give answer.
Inge
----- Original Message -----
From: "Carl VanWormer" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, January 24, 2012 8:01 PM
Subject: [TN] Wave solder - filling of "empty" holes
We have a PCB assembly with a 2x5 pin "engineering" header that is not
populated on our production boards. The normal results of our CM's wave
solder process yields boards with the 10 holes (.040" dia.) filled with
solder. Our pointed spring-probe test fixture hits the centers of these
solder-filled holes, and all is good with the world . . .
Occasionally, we have some boards that do not have all of the holes
filled (I can provide a picture if it helps the discussion). The test
fixture spring-probes may penetrate into the unfilled holes, making only
intermittent contact with the hole-walls. My final solution may be to
obtain spring-probes with wider tips to bridge the hole, making contact
with the annular ring, but I'd like to get opinions from the group as to
my expectations of hole-filling in the wave solder process.
I'm sure that 10mil holes will always fill, and 1000mil holes, will
never fill. What expectations should I have with my 40mil holes (in my
62 mil thick PCB)? If the consensus is that the holes should fill, what
suggestions can I give to my CM to facilitate my desired hole filling?
Thanks,
Carl
Carl Van Wormer, P.E., AE7GD
Senior Hardware Engineer
Cipher Systems
1800 NW 169th Place, Suite B-100
Beaverton, OR 97006
Cipher Systems (503) 617-7447 x 5163
Direct Line (503) 425-5163
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