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January 2012

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Subject:
Re: ist report: PCB vs baking vs design
From:
Brian Ellis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Brian Ellis <[log in to unmask]>
Date:
Thu, 5 Jan 2012 17:48:57 +0200
Content-Type:
text/plain
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text/plain (90 lines) 
I'm not sure whether there may not be a copyright issue here, even if
the IPC printed it in its proceedings. I feel this should be clarified.

Brian

On 05/01/2012 17:27, Steve Gregory wrote:
> Hi Inge!
>
> Got your report and have it posted. It's here:
>
> http://stevezeva.homestead.com/moisture_txt.pdf
>
> Also, remember my purple solder from just a bit ago? Got a really good report (XRF, SEM/EDS, cross-section, micro-photographs, the whole nine yards) back from one of our own Technetters that I will post later.
>
> Stay tuned...
>
> Steve
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Inge
> Sent: 03 January, 2012 16:19 PM
> To: [log in to unmask]
> Subject: [TN] ist report: PCB vs baking vs design
>
> Here is the first report, quite new facts for many, I guess, whilst routine for old CAD foxes.
> Key: be aware of humidity on inside of a PCB. Don't think this is  a simple matter, far from.
> You can even cause damage to a PCB when you think   ' let's increase the
> temperature ' , 'let's double the time'  , or other home made countermeasures.
>
> I send it to Steve for best way of distribution. If there is another and better, give advice.
>
> Ingte
>
>
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