Smart card some times uses silicone. But it is more or less as potting for the cavity that containing the chip. It is somewhat RF, if your source is uses for such an application (low power, passive usually with large support area. Check the smart card papers that 8-9 years old you might find some info. The environment is not that harsh, no thermal shock requirements).
Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Brian Ellis
Sent: Tuesday, January 17, 2012 1:23 PM
To: [log in to unmask]
Subject: Re: [TN] silicone-based underfill. Resending in plain text
I'm not keen. The high CTE is compounded that silicones transmit shocks
like gangbusters because the supposed elasticity is time-dependent. In
addition, humidity will go through it like an express train if you
should happen to leave the slightest hygroscopic contaminant under the
component. You may also need to use a primer to obtain maximal adhesion
to the component parts ans any solder mask.
I would prefer an underfill from the same family of polymers as the
solder mask.
Brian
On 17/01/2012 19:19, Ahmad, Syed wrote:
> While trying to gather info on possible options for an underfill for an approximately 2 x 2 mm chip with about a dozen solder balls, we came across a silicon-based underfill online. Any experience or info about its use in an RF system? A good source for it if it is a viable option?
> Thanks.
> Syed Sajid Ahmad
> Center for Nanoscale Science and Engineering (CNSE)
> NORTH DAKOTA STATE UNIVERSITY
> www.ndsu.edu/cnse
>
>
>
>
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