I'm not keen. The high CTE is compounded that silicones transmit shocks
like gangbusters because the supposed elasticity is time-dependent. In
addition, humidity will go through it like an express train if you
should happen to leave the slightest hygroscopic contaminant under the
component. You may also need to use a primer to obtain maximal adhesion
to the component parts ans any solder mask.

I would prefer an underfill from the same family of polymers as the
solder mask.

Brian

On 17/01/2012 19:19, Ahmad, Syed wrote:
> While trying to gather info on possible options for an underfill for an approximately 2 x 2 mm chip with about a dozen solder balls, we came across a silicon-based underfill online. Any experience or info about its use in an RF system? A good source for it if it is a viable option?
> Thanks.
> Syed Sajid Ahmad
> Center for Nanoscale Science and Engineering (CNSE)
> NORTH DAKOTA STATE UNIVERSITY
> www.ndsu.edu/cnse
>
>
>
>
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