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January 2012

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Tue, 17 Jan 2012 09:09:31 -0600
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It will always evolve, but never go away. And there will always be rework.......
I read the article about the self-healing solder joints and thought that was cool, until I realized it does no good when the operator puts the entire device into the board backwards.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ioan Tempea
Sent: Tuesday, January 17, 2012 8:49 AM
To: [log in to unmask]
Subject: [TN] What is the future of electronics assembly?

Dear Technos,

 

I can't help but thinking about the future of our trade. Will electronics assembly, the way we are doing it now, still be around 5 years from now?

 

I mean, with printed electronics and nano materials, a manufacturing plant equipped with solder paste printers, insertion machines and wave, will still be in use? Even Joe Fjelstad's Occam process requires completely different machineries.

 

As you might have guessed, the bottom line is: what technologies and equipment should we start looking at NOW, so that we still be able to make ends meet by the end of the decade?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]>  
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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