Vandervoort's Principles of metallography lists a 3% solution of H2O2.  I use 25 ml NH4OH with 25 ml H2O and about 0.25 to 0.5 ml concentrated H2O2 and I get good results

Regards,
Andy
 
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-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Monday, January 16, 2012 12:21 PM
To: [log in to unmask]
Subject: [TN] Copper etchant, 1:1:1

Folks,

   Is there a real chemist out there  or someone very knowledgeable of etchants?
        DI water                                        10ml
        Ammonium Hydroxide      28.0 - 30.0%    10ml
        Hydrogen Peroxide               35              10ML
        Polish, 6, 3, & 1 micron
Final polish 0.05 Alumina suspension
        3 -5 seconds, flush with water

Which of the two chemicals would I increase volume to get stronger delineation/demarcation region of plated copper.   The process being equal will not yield the same etchant quality.  The variable is the quality of overseas copper suppliers.

Victor,




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