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January 2012

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Subject:
From:
R Sedlak <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, R Sedlak <[log in to unmask]>
Date:
Mon, 16 Jan 2012 09:52:14 -0800
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Victor:  You have SO much of all reactants, that increasing any one will likely not give you a noticeable change.  Suggest you try adding SMALL amounts of chloride.   Try making a 10% solution of salt (sodium Chloride), initially add 1 drop to your mix, adding ammonia, then salt solution, then peroxide.

If no results, add two drops salt, then 4 drops, then 16 drops.  Peroxide and chloride can give you some highly unpleasant results, so I recommend starting with small amounts, and increasing slowly.

Rudy Sedlak (a card-carrying chemist!)
RD Chemical Company

--- On Mon, 1/16/12, Victor Hernandez <[log in to unmask]> wrote:

From: Victor Hernandez <[log in to unmask]>
Subject: [TN] Copper etchant, 1:1:1
To: [log in to unmask]
Date: Monday, January 16, 2012, 9:20 AM

Folks,

   Is there a real chemist out there  or someone very knowledgeable of etchants?
        DI water                                        10ml
        Ammonium Hydroxide      28.0 - 30.0%    10ml
        Hydrogen Peroxide               35              10ML
        Polish, 6, 3, & 1 micron
Final polish 0.05 Alumina suspension
        3 -5 seconds, flush with water

Which of the two chemicals would I increase volume to get stronger delineation/demarcation region of plated copper.   The process being equal will not yield the same etchant quality.  The variable is the quality of overseas copper suppliers.

Victor,




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