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January 2012

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Subject:
From:
"David D. Hillman" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Mon, 16 Jan 2012 11:38:51 -0600
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Hi Phil - a penetrameter is a calibration device widely used in the
welding and casting industry to calibrate defect sizes  (aka voids, holes,
etc.) in X-ray applications. The penetrameter consists of a metal plate in
a variety of thicknesses with very precise, known hole sizes which you can
then use for calibration of your X-ray process However,  most of the
industry penetrameters don't have holes in the range we need them so you
need to carefully put additional smaller holes in a penetrameter for BGA
voids applications.

Dave



[log in to unmask]
01/16/2012 10:53 AM

To
"TechNet E-Mail Forum" <[log in to unmask]>, <[log in to unmask]>
cc

Subject
RE: [TN] BGA X-ray baseline setting






Dave,

Are you saying we should drill holes into BGA balls in order to fine
tune the xray machine?  I have to admit I had never heard of a
penetrometer and still find it a bit difficult to envision how we would
use one to penetrate BGA voids.

Phil

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of David D. Hillman
Sent: Friday, January 13, 2012 5:25 AM
To: [log in to unmask]
Subject: Re: [TN] BGA X-ray baseline setting

Hi Wee Mei - one method of characterizing and setting a X-ray baseline
is to purchase a penetrometer or make one with specific drilled holes
sizes.
The most of the standard industry penetrometers don't have holes sizes
that correspond with the voids sizes we are concern about in electronics
but you can modify one fairly easily to fit the bill. Good Luck.

Dave Hillman
Rockwell Collins
[log in to unmask]




Lum Wee Mei <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
01/13/2012 01:29 AM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Lum Wee Mei     <[log in to unmask]>


To
<[log in to unmask]>
cc

Subject
[TN] BGA X-ray baseline setting






Dear TechNet Buddies,

In IPC-A-600, the standard provides states the inspection magnification
requirement. For external observation : at 1.75x and progress to 40x if
acceptable condition of a suspected defect is not apparent. Such
inspection magnification requirement is not given in IPC-7095 for BGA
x-ray. What is the common industry practice on :

(a)    Tube voltage

(b)   Tube power

(c)    Filter strength

(d)   Averaging

I asked because I worry that I may unintentional set a 'wrong' tube
voltage that could result in the effect known as "Voltage Blooming'. I
do
not want to cause false alarm due to my incompetency and result in wrong

inspection judgment on the void size.

Thanks and regards,
~wee mei~


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