Where I am working presently they are having component failures that are soldered with water soluble flux and solder. I observed their cleaning process and they are using room temperature distilled water and spot cleaning the solder joint only. Any opinion on this cleaning process pro/con? The flux that is being used 2331-ZX which has 2.2% halides. The tech data sheet for this states that DI-water of distilled water heated to 130° to 150° Fahrenheit and flush the area.
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