Subject: | |
From: | |
Reply To: | |
Date: | Tue, 31 Jan 2012 08:39:36 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Do you mean the via in the adjacent dogbone pad, or the via-in-pad? I guess it doesn't matter, they should both be plugged. The adjacent via should be soldermask plugged to prevent wicking (solder ball thieving). A solder mask dam alone is not sufficient to prevent this. Molten solder will wick right under the soldermask dam.
The via-in-pad needs to be filled (Peters or equivalent) and plated over so there is no dimple. This is required to prevent large solder voids and "blowouts" from occurring.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of prashant chopra
Sent: Tuesday, January 31, 2012 3:18 AM
To: [log in to unmask]
Subject: [TN] BGA via plugging
Hi,
I need help to have expert inputs on whether we need to have the via under the BGA plugged? Does all BGA via should be plugged or only required for fine-pitch BGA? What are the pros and cons? Is there any guideline related to this which can be referred?
Thanks.
Rgds
Prashant
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the Symantec Email Security.cloud service.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|