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Date: | Mon, 16 Jan 2012 11:20:47 -0600 |
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Folks,
Is there a real chemist out there or someone very knowledgeable of etchants?
DI water 10ml
Ammonium Hydroxide 28.0 - 30.0% 10ml
Hydrogen Peroxide 35 10ML
Polish, 6, 3, & 1 micron
Final polish 0.05 Alumina suspension
3 -5 seconds, flush with water
Which of the two chemicals would I increase volume to get stronger delineation/demarcation region of plated copper. The process being equal will not yield the same etchant quality. The variable is the quality of overseas copper suppliers.
Victor,
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