Back in the 90's when I worked for an OEM as a process engineer we tested stencil designs for new packages in advance of board layout.  Then based on data, we provided inputs on pad dimensions and stencil apertures to the CAD librarian.  With known good design inputs for our internal manufacturing processes, stencils were ordered directly from the CAD stencil layer artwork.  

Times have changed. I've worked at 2 contract manufacturer's as a process engineer and we modify virtually every solder paste artwork to meet requirements due to various pad designs and our process needs.  

Dick Krug, CSSBB, CSMTPE
SMT Process Engineer
Sparton Corporation
30167 Power Line Road
Brooksville, FL  34602-8299
p (352) 540-4012  (Internal Ext. 2012)
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