Hi Eric,
I have to see your PCBA design in order to give you DfA recommendation such
as space from V Cut, orientation from the PCB edge, space from screw, SMT
adhesive dispensing, ICT test jig, warpage, PnP calibration, temp. profile,
etc.
Reuven

On Wed, Dec 14, 2011 at 3:35 AM, Eric Laroche <[log in to unmask]>wrote:

> Hi all,
>
> We've been witnessing some field failures related to cracked capacitors.
>  We have seen it on different PCBA's, different panel configurations,
> different physical locations on boards even 3 different capacitor
> suppliers.  The only constant is that we always see it on the 0,1uF ceramic
> 0603.  We've only had a couple of cross sections done as they are
> relatively expensive.  All cross sections done so far show evidence of
> board flexing causing 45degree cracks.
>
> There must be something along our process that causes this flexing.  The
> way I see it, pretty much every step can be the guilty one.  From PnP,
> reflow, repair, ICT, functional testing, depanelling and final mechanical
> assembly...up to some extent, they could all possibly be causing flexing
> and damage to capacitors.  I would like to make a more extensive study to
> isolate the source of our problems.  Are there other methods, less
> expensive than cross sectioning, to see if a capacitor is cracked?
>
> Have any of you faced this problem in the past?  What methods did you use
> to isolate the source of the problem?  What were your results?
>
> Thanks for your help,
>
> Eric
>
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