For QFN, 7093 is the guideline you want. QFN is rather different compare to the BGAs.
Joyce Koo
Materials Researcher - Materials Interconnect Lab
Research In Motion Limited
Office: (519) 888-7465 79945
Mobile: (226) 220-4760
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Bogert
Sent: Tuesday, December 13, 2011 3:28 PM
To: [log in to unmask]
Subject: Re: [TN] TI Paste Recommendations
December 13, 2011
Solder paste size can depend on the part manufacturer recommendations. For example, Freescale for their BGA P013 processor recommends that the PC board solder pad and stencil aperture diameters should generally be the same; a 1 to 1 ratio.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of William Noel
Sent: Tuesday, December 13, 2011 2:52 PM
To: [log in to unmask]
Subject: [TN] TI Paste Recommendations
Hello all - I am working on creating a 24 pin QFN footprint for my CAD library. Is there a valid reason for making the solder paste smaller than the actual pad outline? I notice that TI consistently seems to recommend a smaller paste outline than pad outline. Additionally, they recommend a series of small square paste squares to appear on the thermal pad rather than a single smaller square of paste. Essentially, IPC-7351 recommendations are different than the TI recommendations. Any help? Thank you.
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