December 13, 2011

It depends (borrowed from famous cleaning guru on numerous IPC
committees).

Reflow temperatures for soldering depends on a number of factors,
including, but not limited to the solder paste used and on the specific
part to be reflowed.  Biggest concern is probably with BGA parts.
Reflow temperature can be 240C or greater depending on the solder alloy
used for the solder balls, as noted in a Werner Engelmaier paper,
"Inadequate peak Reflow temperatures:  A Real reliability issue with
lead-free solders that appeared in the June 2008 issue of Global SMT &
Packaging".  Unfortunately Werner passed away earlier this year and we
will and are all going to miss his expertise on this subject as well as
many other subjects pertaining to soldering reliability.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Tuesday, December 13, 2011 5:17 AM
To: [log in to unmask]
Subject: [TN] Thermal profile for lead free

Hi all,

 

Could you give me some data on ideal temperature against ramp time for
lead free profile.

 

We have a 8 zone oven with profiles as follows. Are they both ok from a
solder process point.

 

At reflow zone Temp is at 220 c - 240c max for 30secs on one product. 

 

Any help or thoughts on thermal profiling would be great.

 

Regards

 

Chris 


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