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December 2011

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Subject:
From:
Leland Woodall <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leland Woodall <[log in to unmask]>
Date:
Tue, 13 Dec 2011 11:46:28 +0000
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Chris,

I'd begin with the profile recommendations given by my solder paste supplier.  Then I'd take into consideration the reflow specs for any temperature sensitive components, usually found to be small aluminum electrolytic capacitors.

On a side note, if you're using SAC 305, a peak of 220 C is a bit low.  This is barely above the melting point.  Again, check the technical data sheets for your particular paste.

Leland

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
Sent: Tuesday, December 13, 2011 5:17 AM
To: [log in to unmask]
Subject: [TN] Thermal profile for lead free

Hi all,



Could you give me some data on ideal temperature against ramp time for lead free profile.



We have a 8 zone oven with profiles as follows. Are they both ok from a solder process point.



At reflow zone Temp is at 220 c - 240c max for 30secs on one product.



Any help or thoughts on thermal profiling would be great.



Regards



Chris


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