ENIPIG.
This finish is essentially ENIG with additional layer of Pd. The PD needs to
be dissolved as well as the Au before you get to the underlying Ni.
In an ideal world you shouldn't notice any difference. Unfortunately this is
just the best of all possible worlds. So in practice if it solders a little
like slow ENIG that will be reasonable expectation. Be aware though this
stuff can easily do a reasonable emulation of wood, [just more expensive].
As to profile adjustments this is somewhat of a "Query string Length"
situation. Don't know anything about your work type or existing profile. All
we can really say is: If you  were starting with a clean sheet, the most
likely profile type for success would be a straight ram. Perhaps with a
slightly longer TAL and probably with short pause around solidus and then to
peak. [As opposed to the now historic/traditional ramp soak ramp]. This to
ensure retention of max flux effectiveness though time of joint formation. 


Regards

Mike Fenner 
Bonding Services & Products
T: +44 [0] 1865 522 663 E: [log in to unmask]

 


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Gerald Bogert
Sent: Saturday, December 10, 2011 12:19 PM
To: [log in to unmask]
Subject: [TN] Soldering part with CUNIPDAU solder leads

December 10, 2011

 

We have OEM who will be reflow soldering Sn64BCT25244, 24 lead SOIC with
CUNIPDAU leads to FR-4 CCA.  Any issue with reflow soldering this part
using traditional Sn63Pb37 solder alloy?  Any unique reflow solder
profile required? 

 

[log in to unmask]


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