Ioan,
IPC-HDBK-830 is a reference guide for instruction, not a performance 
specification.  If someone wrote a process spec around that Handbook, they 
have been smoking some serious weed.

If, you meant IPC-CC-830, that is a materials qualification document, not 
a performance specification for assemblies.

Neither of these should be in an engineering drawing. 

Doug Pauls



Ioan Tempea <[log in to unmask]> 
Sent by: TechNet <[log in to unmask]>
12/08/2011 12:04 PM
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[TN] Coating under connectors






Dear Technos,

 

Per IPC-HDBK-830, all solder joints and exposed leads should be coated. 
How does this apply to SMT connectors like this 
http://ipc-technet.groupsite.com/gallery/22102 ?

 

In this case, the connector is very low profile, all the joints plus many 
vias are hidden under the body and the coating will probably not wick over 
the whole area, so there will be many exposed metal features not coated.

 

I suppose the -830 requirement still stands and the situation under the 
connector is a defect?

 

Thanks,

 

Ioan Tempea, ing.
Ingénieur Principal de Fabrication / Senior Manufacturing Engineer
T | 450.967.7100 ext.244
E | [log in to unmask] <mailto:[log in to unmask]> 
W | www.digico.cc <http://www.digico.cc/> 

 
 N'imprimer que si nécessaire - Print only if you must

 


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