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December 2011

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Tue, 20 Dec 2011 10:26:14 -0800
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text/plain
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We found an existing design which has a device (QFP with center slug)
that has too small of a center slug pad on the PWB.  Within the
corresponding area where the center slug pad should have been, the
designer put some signal vias.  Therefore the only thing preventing the
signal via from shorting out to the center slug (ground) is the solder
mask. No failures to date have been reported, even after a 20g vibe
test.

Is this a violation of J-STD-001 or perhaps IPC-2221 -6.3.4 regarding
minimum electrical spacing?  



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