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December 2011

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TechNet E-Mail Forum <[log in to unmask]>, Pete <[log in to unmask]>
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Tue, 20 Dec 2011 08:44:54 -0600
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I get that he doesn't want flux under the part, but does he want solder in the holes?  In our RoHS changeover testing, we found that as lead:hole ratios got smaller, it was far more difficult to get solder flowing up.  Small holes that used to at least partially fill with SnPb would barely tent over with SAC.  

At least he'd have more flux available now to fill up those empty holes. 

Pete

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