7 days until the Fat Man comes visiting.  Yikes!

We recently had a problem with flux residue under a PTH dual inline IC.  The problem appears to be caused by our hole diameter of 0.035" and the tapered shape of the step in the leads allowing the device to sit closer or flush with the board causing apparent flux entrapment.

I'm thinking this is more of a process issue of amount of flux, board orientation in the wash, wash time/temp or DI water quality.

The responsible engineer would like to decrease the hole size to 0.025 to effectively raise the part above the board.  And he wants to change all the ICs on this board and most likely all his boards going forward.

So the questions comes up, what is the "standard" hole size for a dual inline IC, 0.021 wide pin, plated thru hole, 0.062 thick board, OA flux foam application and RoHS wave solder.

Please add some sanity to my life.

Phil Nutting
Design for Manufacturing Engineer
Kaiser Systems, Inc.
126 Sohier Road
Beverly, MA 01915
Phone: 978-922-9300 x1310
Fax: 978-922-8374
e-mail: [log in to unmask]<mailto:[log in to unmask]>
www.kaisersystems.com<http://www.kaisersystems.com>
www.linkedin.com/in/philnutting<http://www.linkedin.com/in/philnutting>


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