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December 2011

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Subject:
From:
Reuven Rokah <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Reuven Rokah <[log in to unmask]>
Date:
Thu, 15 Dec 2011 21:11:22 +0200
Content-Type:
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The surface finish on PCBs is also a factor in the temp. profile.
ENIG require more thermal energy comparing to other finishes such as HASL
or OSP.

On Wed, Dec 14, 2011 at 6:12 PM, Leif Laerum <[log in to unmask]> wrote:

> Chris,
>
> I think you attached the profiles, but all attachements are stripped on
> this reflector.
>
> It is all about the mass of the board and the chemistry of the paste.
> There is no ideal profile. Once you have one you like you may use this as a
> starting point, but if you showed us a profile, I would venture to say that
> there are no one on this reflector that could say with certainty that it
> was the right profile for your board. The proof is in the pudding.
>
> About  80 % of our boards are leadfree and we have found that the Ramp To
> Spike curve works best for us. Soaking tends to spend the flux too early.
> The Ramp must keep the delta temp across the board to a minimum. You must
> adjust the zones and the belt speed such that the profile is as short as
> possible while keeping the delta at a minimum.
>
> That is where your profiling starts.
>
> Good luck.
>
> -----------------------------------------
> Leif Erik Laerum
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Christopher Young
> Sent: Tuesday, December 13, 2011 4:17 AM
> To: [log in to unmask]
> Subject: [TN] Thermal profile for lead free
>
> Hi all,
>
>
>
> Could you give me some data on ideal temperature against ramp time for
> lead free profile.
>
>
>
> We have a 8 zone oven with profiles as follows. Are they both ok from a
> solder process point.
>
>
>
> At reflow zone Temp is at 220 c - 240c max for 30secs on one product.
>
>
>
> Any help or thoughts on thermal profiling would be great.
>
>
>
> Regards
>
>
>
> Chris
>
>
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-- 

Best Regards,

*Reuven Rokah*

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