IPC_NEW_RELEASES Archives

December 2011

IPC_New_Releases@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Kim Sterling <[log in to unmask]>
Reply To:
New release announcements of IPC documents (all languages)
Date:
Fri, 16 Dec 2011 20:06:14 +0000
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (3046 bytes) , winmail.dat (10 kB)
These two presentations are available now for purchase in the IPC online store. Please click the links below for more information.

PLASMA-IRVINE-11-11<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=326d4483-5b1c-e111-b2f9-00155d05285c>
Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for PCBs
"Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for PCBs" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011. The paper was written by David Rund, director of business development for materials of the Christopher Group, and was presented by Chrys Shea. The author describes a new method of applying a polymer material to the surface of a PCB to improve corrosion resistance while acting to improve reliability and solderability while being environmentally friendly. The solder joints were then tested for shear strength, contact resistance, corrosion resistance and RF signal loss. This presentation includes the synchronized slides and audio. 20 minutes. Released 2011.
IPC Member Price $35.00
Nonmember Price $50.00

UNDERFIL-IRVINE11-11<https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=eec240d6-581c-e111-b2f9-00155d05285c>
Underfill Selection and the Impact on Reliability
"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of different types of underfill in augmenting product reliability whether environmental or mechanical and their effect on reworkability. This presentation includes the synchronized slides and audio. 27 minutes. Released 2011.
IPC Member Price $35.00
Nonmember Price $50.00

Happy Holidays!

Kimberly Sterling, CAE
Vice President, Marketing and Communications
IPC - Association Connecting Electronics Industries
3000 Lakeside Drive
Suite 309 S
Bannockburn, IL 60015-1249 USA
+1 847-597-2805 tel
+1 847-615-5605 fax
[log in to unmask]<mailto:[log in to unmask]>
www.ipc.org<http://www.ipc.org>

________________________________

To unsubscribe from the LSVtest list, click the following link:
http://listserv.ipc.org/scripts/wa.exe?SUBED1=IPC_NEW_RELEASES

--------------------------------------------------------------------------------
IPC_New_Releases Mail List provided as a free service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF IPC_New_Releases
Search previous postings at: http://listserv.ipc.org/archives/index.html
Please visit IPC web site (www.ipc.org > Knowledge > Email Forums) for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
--------------------------------------------------------------------------------


ATOM RSS1 RSS2