DESIGNERCOUNCIL Archives

December 2011

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
DFH : Design for Humidty
From:
Dave Schaefer <[log in to unmask]>
Reply To:
(Designers Council Forum)
Date:
Thu, 8 Dec 2011 13:49:26 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (14 lines) 
Anyone have experience determining when an Electronic Assembly requires added precaution against humidty ?

Are there any specifications which outline when an assembly must be conformal coated / potted / moisture sealed ?

I've designed many PCBs over the years for various Military and Automotive applications where specific environmental protection was required but this was always laid out in reference to a specific standard on the statement of work. In this case I simply have a requirement that the assembly remain functional at a certain humidty level.

---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 16.0.
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL)
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
---------------------------------------------------------------------------------

ATOM RSS1 RSS2